Aehr Test Systems publishes corporate presentation on wafer-level test and burn-in systems for advanced semiconductors

• Aehr Test Systems highlighted wafer-level test and burn-in as a key growth driver, targeting AI processors, silicon photonics, and silicon carbide and gallium nitride power devices.
• FOX-XP platform positioned for high-volume wafer-level burn-in, configurable up to 18 wafers in parallel with test and burn-in temperatures up to 150C.
• Sonoma high-power package-level burn-in platform cited as having the largest installed base for AI-processor HTOL at test houses.
• Presentation described production capacity wins tied to a major hyperscaler’s AI accelerator burn-in, with an expected multi-year ramp at Asia-based contract test operations.
• Company also flagged a paid wafer-level burn-in evaluation with a leading AI processor supplier, citing recent positive development results.

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