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SCHMID Group Delivers First Specialized InfinityLine H+ System For Panel-Level Packaging Applications With Formats Of Up To 700×700mm To U.S. Technology Company

Benzinga·03/04/2026 12:18:35
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SCHMID Group (NASDAQ:SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) applications with formats of up to 700×700mm to a leading U.S. technology company.

The newly developed InfinityLine H+ platform is based on a highly flexible, expanded modular architecture, enabling SCHMID to address the rapidly increasing panel sizes required by next-generation substrate manufacturing. The system incorporates advanced engineering concepts enabling horizontal processing of large-format substrates, allowing customers to implement critical process steps with high economic efficiency, high process stability, and improved throughput.

This project highlights SCHMID's engineering expertise in developing customer-specific production solutions for markets that demand the highest standards in quality, cleanliness, and process control. The delivery further strengthens SCHMID's position in high-growth applications such as AI-driven computing infrastructure, advanced high-performance computing (HPC) platforms, as well as space and defense electronics.